The Deceptive Simplicity of Intel-micron New Memory Tech

The coming memory chips that will meet the ever-growing demand for capacity in smart phones,which now hold up to 128 gigabytes of storage space. For social media and other companies with huge servers, Micron will be able to offer memory chips that can store more than three times as much data as some other NAND products do.

Micron and Intel might have an agreement as part of their partnership to protect them from having to provide joint research data to a new owner in the event either company is purchased, Van Hees said.Micron’s new chip is its latest effort to expand in the highly competitive and often volatile memory inside

The Third Dimension 3D Xpiont

No doubt 3D XPoint is terrible name but at least this name is descriptive.Basically, these chips store data by changing the electrical resistance at those many cross points. This is done with a tiny contraption that Fazio calls a “selector.” This is kind  like a diode, which can switch from low resistance to high.

Intel has once again shown its ability to innovate new materials and new technology. First in memory, to be followed by similar materials and 3D XPoint innovations in processors and then in integration of memory/storage and processor at the silicon level so that one barely visible piece of silicon will function as a complete computer with processing, memory, storage and communication absorbing energy to run from its surroundings.It has following features.

intel corporation and micron technology

  • Intel (INTC+1.5%) and Micron (MU +3.7%) proclaim their jointly-developed 3D XPoint (pronounced “3D crosspoint”) non-volatile memory technology delivers speeds up to 1,000 times faster than NAND flash (also non-volatile), and is 10x denser than DRAM (much faster than NAND, but volatile and less dense).
  • The NAND JV partners declare 3D XPoint “significantly reduces latencies, allowing much more data to be stored close to the processor and accessed at speeds previously impossible for non-volatile storage.” Unique materials and a cross point array structure are said to make 3D XPoint possible.
  • Major write endurance improvements are also promised relative to NAND. The first product will be a 128Gb (16GB) chip.
  • Intel/Micron are sharing additional at a San Francisco event (webcast). Shares of both companies are higher amid a 0.6% gain for the Nasdaq.
  • Update: More detailsfrom Fortune. 3D XPoint samples are expected by year’s end, and commercial shipments are set for 2016.